Saras Micro Devices is working to eliminate the power challenges of large HPC computing engines, AI, virtual reality, 5G and more with new panel-level power delivery technology. Our heterogeneous integration solutions deliver substantially improved HPC performance per Watt, reduced design cycle times and reduced 3D footprint through seamless co-design — all at a cost advantage. Advantages include: 2X power efficiency; flexible design options; lego-block approach; double-sided connections standard; chip passive co-design; group plane design available; customizable IO; and a low profile. Learn more at