2023 Edition. In Engineer of the Year
Markus Leitgeb is nomintated for his work developing AT&S Embedding Technologies as e.g, ECP to production level. He leads the R&D team for Micro Electronics in AT&S which is developing new concepts for IC Substrates and Advanced Packaging Solutions. Markus has joined AT&S in December 2000 after graduating from the Leoben University, Austria. He was responsible for evaluation and implementation of new testing methodologies (e.g. Drop Test) and development of alternative manufacturing concepts for flexible interconnections as well as cavities. Markus has filed more than 100 patents and has published several papers in the field of PCBs and Packaging (2014 IPC APEX EXPO Best International Paper Award). Markus is an active member in iNEMI and in the Packaging Technologies subcommittee of ECTC.