Siemens Tessent Multi-die

2023 Edition. In Herb Reiter Design Tool Provider of the Year

2.5D and 3D heterogeneously integrated devices utilize densely packed dies presenting significant challenges for IC test using conventional two-dimensional processes. Siemens' Tessentâ„¢ Multi-die software addresses these challenges with a comprehensive DFT automation solution for highly complex tasks associated with 2.5D and 3D IC designs and greatly removes one of the barriers to 2.5/3D HI adoption.