ClassOne Technology continues to advance process technology for manufacturers of semiconductor, compound semiconductor and MEMS devices. In 2022, the company significantly broadened the capabilities of its Solstice™ single-wafer wet-processing platform, an industry leader in electroplating for advanced applications in heterogenous integration (HI), e.g., micropillar, high-aspect-ratio TSV, and RDL. Customers can now implement both electroplating and surface preparation (SP) processes on a single Solstice system, enabling ultimate flexibility and modularity in a single compact footprint. These surface prep processes include solvent strip, wet etch, metal liftoff, and single-wafer cleaning – all increasingly vital for advanced packaging. Moreover, furthering Solstice’s role as an enabling technology for HI, ClassOne and Fraunhofer ENAS announced a partnership to advance hybrid bonding capability for wafer-to-wafer and chip-to-wafer advanced packaging applications.