Henkel Corporation

2023 Edition. In Materials Supplier of the Year

Building on its semiconductor materials leadership, Henkel achieved several strategic product launches in 2022. These innovations address some of the most pressing issues in semiconductor
packaging including: high thermal requirements, transistor scaling, advanced Si node chip integration, and ongoing miniaturization. In the die attach space, three new high-reliability materials were commercialized: a non-sintering high-thermal 30 W/m-K (among the highest thermal performance in the market without sintering) paste, an ultra-high-thermal 165 W/m-K pressureless sintering material, and a BOM simplification die-attach film for leadframe & laminate packages. In the flip chip protection arena, Henkel debuted a capillary underfill for leading-edge Si node flip chips that is now used in top-tier smartphones. Also, breakthrough active mold packaging work was conducted with LPKF Laser & Electronics AG using Henkel liquid encapsulants to achieve ultra-
thin layers for laser direct structuring.