Micross Advanced Interconnect Technology is a leader in 3D integration technology, having developed a broad range of 3D process capabilities and achieved successful demonstrations of 3D-integrated IC stacks for IR focal plane arrays and silicon interposer for embedded computing modules. Micross AIT has been conducting research and development in 3D integration since 1999, building on decades of experience in the development of advanced microfabrication and packaging technologies. Clients can take advantage of the 2.5D/3D integration technology platform to realize more highly integrated microsystems with increased functionality, short interconnect length and decreased size, weight and power (SWaP). From the design and fabrication of custom test vehicles to the application of 3D integration processes modules on fully functional IC wafers, Micross AIT can provide a variety of integration solutions to meet specific project needs.