Lam Research introduced SABRE3D EX, latest electroplating innovation in 2021. It features extremely versatile equipment configuration for numerous applications critical in heterogeneous integrations: cu pillar, microbump, RDL and UBM. SABRE3D EX has multiple industry first technologies addressing market specific challenges.

The heart of any electroplating tool is the plating chamber; it has been upgraded to Scimitar technology for enhanced mass transfer - addressing coplanarity challenge especially for mix CD schemes in Cu pillar and microbump. It delivers >20x lip seal lifetime (vs competition) for lowest consumable cost . There is soluble Sn anode and chemistry management system for >40% chemistry cost savings . For Fanout, SABRE3D EX features extreme warped wafers handling up to 7mm and fastest megapillar plating (>50ASD).

These innovations, with award winning customer service, made Lam electroplating tool increasingly the preferred choice among leading industry players.