In response to the miniaturization and functional densification of semiconductor packages for SiP and heterogeneous integration, Indium Corporation offers a comprehensive portfolio of solder pastes designed for ultrafine-pitch printing. SiPaste® Solder Paste series is specifically designed for fine feature printing with fine powders ranging from Type 6 to Type 8. They help customers Avoid the Void®, reduce slumps, and demonstrate consistent superior printing performance. Among its offerings, award-winning SiPaste® C201HF is specifically formulated to accommodate fine feature printing, combining superior non-wet open performance with excellent stencil print transfer efficiency to satisfy the broadest range of process requirements and boost SPI yields. Additionally, SiPaste® 3.2HF has been used by leading OSATs for more than 5 billion mobile SiP modules.