Large area cluster tool for single panel processing - introduced in 2017 - already volume production-proven by major IDMs and OSATs with panel sizes up to 550mm. The latest version now offers the capability for substrate sizes up to 650mm. It integrates degas, etch, and deposition capabilities for Advanced Packaging applications including Fan-Out Panel Level Processing (FOPLP) and advanced IC-Substrate manufacturing. For instance, Samsung Electro-Mechanics Co. Ltd. worked with Evatec to solve challenges in Fan-out packaging technologies for the successful volume production of their FOPOP for Samsung’s GALAXY watch (package size reduced 65% of the previous package size, RDL L/S at 7/8µm with a joint pitch to memory of 150µm. Semco underlined the success factors: "With Evatec and their solution for a panel level sputtering tool we found a strong reliable partner to help us solve the 3 main challenges we needed to address: Warpage of the substrate, Fine pitch RDL, and Process reliability.