When it comes to requests for small amounts of packages, especially from small and medium sized companies or demands of customization, currently there often is a gap in the market, since packaging is lined out for highly standardized, high output orders. At MicroPack3D our aim is to introduce additive manufacturing to electronic packaging. Our newly developed process uses smart manufacturing for electronic packaging to address this problem.
Backed with TU Dresden, one of Germany’s leading research universities, and a closely linked to industry in Dresden, one of Europe’s biggest semiconductor hubs, we work closely with scientific and corporate partners to perfect our manufacturing process. For our first customer we have realized a package in a high power application which we are now selling regularly.
Originally funded in 2019 by the prestigious EXIST Forschungstransfer, we are already in the last steps of our Seed Funding and are looking forward to new customers and the years to come.