Co-Editors of the book "Advances in Embedded and Fan-Out Wafer Level Packaging Technologies", successfully published in 2019. The 2nd edition "Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for advanced application spaces: HPC and SiP" is in preparation (planned to out beginning 2022). Readers commented: "A well-researched summary of today’s developments in two of the most important packaging technologies driving product miniaturization and increased feature complexity. Included are developments from many of the leading companies developing these technologies. For anyone trying to understand how these technologies perform or are constructed, this book contains excellent relevant photos and cross-sections explaining the approaches. The editors have compiled a complete understanding of these critical new interconnect technologies starting with design considerations, to manufacturing options, new materials, reliability implications, and the latest developments."