Mosaic Microsystems' Viaffirm™ Temporary Bond Technology
2021 Edition. In Process of the Year
Mosaic Microsystems has launched the Viaffirm temporary bond technology that enables thin glass handling operations and opens up thin glass solutions to existing processes. For many years, glass solutions, particularly with TGV, have been of interest because of the material properties and ability to provide cost effective, thin/small form factor solutions. The emergence of 5G, particularly mmWave, makes glass solutions even more attractive due to the low electrical loss of glass given by dielectric properties and low roughness. The challenge has been establishing industry standard manufacturing methods to make high volume possible. Viaffirm is a temporary bond approach that provides a step change in the ability to process thin glass using existing fabrication processes and equipment and has shown the ability to interface seamlessly with TGV fill, CMP, surface metallization, bond/de-bond tools and also demonstrate die level hermetic TGV unlocking the value of glass for 5G.