ChipInFlex is CEA-Leti’s latest development towards the integration of ultra-thin silicon bare dies within a flexible film. Working with silicon wafers help achieve high resolution of integration. Silicon wafers are well-suited for flexible fan-out packaging. ChipInFlex is also the first packaging solution that can perform collective thinning on the wafer. The electrical interconnection is achieved with gold stud-bumps made on bare dies. The process has been successfully validated on an electrical test vehicle. The first step towards a full electronic system in a flexible label has been made.