Released and qualified a new Cu RDL chemical which delivers highest reliability for sub 5µm LS combined with the capability of via filling to enable next generation of Fan Out technology. The chemistry suite can be used in every available tool set, existing or new., fountain or vertical.
The deposited Cu achieves highest Cu purity, lowest impurity level for Sulfur and Chloride which results in no voiding after temperature budget and finally can be used for Cu-Cu bonding, µBump technology and Cu Pillar.