Nepes, one of the top tier advanced packaging service providers, has initiated supply of high-reliability Fan-Out package service to a US based leading wireless chip maker. Fan-Out manufacturing is stabilized for mass production of the advanced package line recently acquired from Deca Technologies.

“High Reliability Fan-out Package,” supplied by nepes, is a high-tech solution with more than 2 times BLR (Board Level Reliability) performance versus standard fan-out technologies by reducing physical stress on chips through sidewall protection structures. It also uses “Adaptive Patterning” technology which can help to reduce die drift, one of the most chronic problems in the fan-out package, resulting in a higher-yield and higher-quality product at a lower cost. Currently, only two companies, nepes included, can mass-produce this advanced package solution.