Henkel is the premier materials supplier for the electronics assembly and semiconductor packaging industries. Our advanced formulations include a range of products that facilitate electrical interconnect, provide structural integrity, offer critical protection, and transfer heat for reliable performance. Most recently, Henkel has launched two successful products for the advanced packaging of semiconductor devices used in the mobile telecommunications and data center applications. Our wafer applied underfill film (WAUF) materials, LOCTITE® ABLESTIK® NCF 200 series, enables 3-D stacking of electronic chips for high performance computing applications and our post applied capillary underfill material, LOCTITE® ECCOBOND® UF 8000 series, enables high throughput wafer level packaging of processors and memory packages for mobile applications. Henkel provides a strong portfolio of electronics assembly products that enable our customers to be at the leading edge of innovation and technology.