ERS electronic GmbH

2019 Edition. In Equipment Supplier of the Year

ERS electronic GmbH has taken the lead in Fan-Out Panel Level Packaging equipment manufacturing with its new thermal debonding tool, the MPDM700.

The new ERS MPDM700 supports the increasing demand for fast prototyping and New Product Introduction of advanced packaging in large panel format; it offers ERSĀ“s complete range of thermal debonding capabilities and even more powerful warpage adjustment.