![](https://www.3dincites.com/wp-content/uploads/1547480256-wafer.jpg)
Accomplishment
Imec 3D team lead by Eric Beyne for development of a low-warpage wafer-level transfer mold process that is performed post 3D die-to-wafer assembly.
Imec 3D team lead by Eric Beyne for development of a low-warpage wafer-level transfer mold process that is performed post 3D die-to-wafer assembly.