Amkor Technology Portugal (ATEP), formerly NANIUM is a world-class provider of semiconductor packaging, assembly and test, engineering and manufacturing services. ATEP offers in-house capabilities for the entire development chain, from design to multiple wafer level packaging (WLP) technologies, and the flexibility to tailor and test solutions that respond to the most demanding customer requirements. The company is now a leader in 300 mm WLP, both Fan-in Wafer Level Chip-Scale Package (WLCSP) and Wafer Level Fan-out (WLFO), based on embedded Wafer Level Ball Grid Array (eWLB) technology.