2018 Edition. In Engineer of the Year
According to Herb Reiter, our industry enjoyed the benefits of continued feature size shrinking for 5 decades. However, following Moore's Law to 10 nm features and below, is no longer economical for most IC applications. New IC technologies are needed to economically and timely serve many markets. Multi-die ICs (a.k.a. 2.5D & 3D-ICs) are a promising alternative versus following Moore's Law of continued shrinking. They have already proven their value in a number of applications. A fewmulti-die IC designs are scheduled to ramp into high-volume production in 2016 and will help maturing the multi-die EcoSystem, lower cost and time to profit.
And Herb is leading the charge, as both a technical consultant, and as an industry evangelist.