Accomplishment

Last year, Fraunhofer IZM launched a consortium to bring research and industry together on all questions of implementing Panel Level Packaging in industry settings. Their aim was to accelerate standardization, develop a low-cost, industry-ready reference process and channel ongoing research advances into industry as quickly and efficiently as possible. Progress to date has been good, and the Fraunhofer IZM activity in the PLP space has received much notice.