2017 Edition. In
A pioneer in 3D IC technologies using through silicon via technology, Tezzaron Semiconductor has disrupted the semiconductor industry by requiring a whole new set of floor planning and architectures, new design tools, new structures, and new test methods. As such it is forming a family of partners and licencees who together will become the Di3D™ ecosystem; the place where the high-performance world will meet to raise the bar. Tezzaron’s Di3D™ (Dis-Integrated 3D™) technology is a direct attack on the most fundamental problems we face as an industry; transistor density, interconnect power, Interconnect delay and cost. We believe Di3D can be used to continue to drive forward on performance and value for both silicon foundries, product developers and customers.