Dr. Paul Enquist, Vice President of 3D R&D at Invensas, a subsidiary of Xperi, and co-founder of Ziptronix, Inc.
For more than 30 years, Dr. Paul Enquist has been a pioneer in developing cutting edge semiconductor technologies related to high speed devices and circuits, low temperature direct bonding and 3D integration, which have been commercially adopted in more than one billion semiconductor devices, including Sony CMOS image sensors and IO Semiconductor RF front end antenna switch, now part of Qualcomm.
With more than 40 issued U.S. patents to his name, Paul is one of the industry’s pioneers in the development of 3D transistors, including devices and methods of manufacturing. Paul also spearheaded R&D efforts on bonding technologies integral to the development of devices and manufacturing methods of 3D circuits.
As a co-founder and CTO of Ziptronix, Paul was a key inventor of ZiBond and Direct Bond Interconnect (DBI) - fundamental technologies enabling the world's most advanced 3D stacked CMOS image sensors and RF antenna switch shipping in multiple generations of smartphones around the world. These platform technologies are now migrating into a wide range of other high volume semiconductor applications including MEMS, RF SAW and BAW filters, fingerprint sensors, memory and SoC, among others, and are poised to be the interconnect foundation of future 3D electronics, allowing the industry to scale beyond Moore's Law.
Under Paul’s guidance, Ziptronix was acquired by Xperi in 2015. Since the acquisition, Paul has been instrumental in accelerating the further development and adoption of 3D bonding technologies.
Paul holds Ph.D. and M.S. degrees in Electrical Engineering from Cornell University and a B.S. degree in Engineering from Columbia University. He is an IEEE senior member, member of Tau Beta Pi and Eta Kappa Nu.