J-Devices is the world leader in automotive IC packaging and has long-standing relationships with the largest automotive companies and automotive components manufacturers, providing customers access to the Japanese market. J-Devices has a strong turnkey manufacturing presence throughout Japan, offering package development, package assembly, wafer probe and final test. J-Devices is equipped with a large installed test base with burn-in and 100% automated x-ray infrastructure capability. A broad package portfolio and Cu wire technology make J-Devices an ideal OSAT partner for the automotive market.