As a global supplier of advanced semiconductor packaging materials, Dow Electronic Materials’ broad platform provides innovative solutions for metallization, dielectrics, lithography and bonding applications. The most significant achievement over the past year was the introduction of SOLDERON™ BP TS 6000 Tin-Silver, which has rapidly become the leading lead-free solder chemistry for advanced packaging applications. Tin-silver is essential for reliably capping copper pillars, particularly as higher I/O counts and tighter pitches become the norm. No other commercially available solder chemistry has met this tin-silver performance and reliability from a single formulation. SOLDERON BP Tin-Silver is proven in HVM with excellent process flexibility, especially with its wide plating speed range and the tunable nature of silver composition. This is just one example of how Dow Electronic Materials is focusing innovation on addressing key technical challenges in the advanced semiconductor packaging market.