Working with industry to advance electronic packaging technology for over 20 years. Most recently, established a consortium with the entire supply chain to demonstrate RDL 1st ( a.k.a chip-last) and Mold 1st (a.k.a chip-first) to extend Fan-Out WLP to 2.5D integration, Ultra-thin 3D Fan-Out, and 5G Antenna-in-Package applications. In parallel executing cost-effective panel-packaging through the Gen-3 Panel based Fan-Out Consortium.