OmniVision’s new PureCelPlus-S stacked die technology separates the imaging sensor array from the image sensor processing pipeline, supporting additional camera functionality and system level integration into smaller hardware profiles. This design leads to improved sensor performance while enabling a smaller footprint when compared with non-stacked sensors. PureCelPlus-S architecture stacks circuits in the silicon support wafers underneath image sensors, enabling advanced features such as higher dynamic range expansion, on-chip ISP noise cancellation, and fast auto focusing. OmniVision's growing portfolio of compact PureCelPlus-S sensors offer best-in-class image quality and high functionality, delivering superior low-light performance, improved dynamic range, and minimal power requirements.