SWIFT : uniquely developed to deliver a high yielding, high performance package with the thinnest profile in the industry. This package can deliver 2um line/space lithographiy with up to 4 layers of RDL and a very dense network of memory interface vias from bottom package to top package at a very cost competitive price. Due to the nature of fabrication, the package provides a path during processing for known good die to known good die site placement, virtually eliminating the risk of high value die loss during the product build. This is a key distinguishing feature that also allows for significant reduction in cycle time by fabricating the RDL prior to die arrival for assembly and also ultimately improves overall cost by maximizing the yield during fabrication.