3D+  is inspired by heterogeneous integration. Our guest bloggers focus their expertise in 3D, MEMS, and compound semiconductors to investigate how all these technologies are heterogeneously integrated into next-generation applications.

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Citius, Altius, Fortius: Packaging Topics at SEMICON Korea 2018

Winter 2018, and Korea is at the center of the world in both sports and in electronics. Sports, of course, because of PyeongChang, host city for the 23rd Olympic Winter Games, with participants ranging from Eritrea to Tonga, along with the usual cold-weather-country (Norway, Canada, Sweden, etc.) players who showed up for the Games. And electronics, of course, specifically semiconductor device fab... »

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Continental Drifts or Tectonic Shifts? Advanced Packaging 2017

That’s great it starts with an earthquake … R.E.M. Boxing Day 2017 ended with an earthquake in Silicon Valley, at 10:32 pm, a magnitude 3.9 temblor near Alum Rock I thought could have been my neighbor dropping something heavy in the apartment upstairs, except that nobody lifts and drops anything that heavy, for that long, in the building where I live. No reports of damage, but the shaking came... »

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SEMICON West 2017: The Semiconductor Industry at a Young 50

The semiconductor industry is acting quite young for its age. And that’s just not me saying it; over and over again during SEMICON West 2017 I heard some variation of the phrase “We’re just getting started.” What was it that accounted for the upbeat and buoyant mood at SEMICON West 2017 this month, despite Moscone South Hall being a gaping hole clear down to the basement as a result of Sou... »

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Heterogeneous Integration Makes an End Run Around 7nm Silicon at SEMI ASMC 2017

I like to think that someday soon a perfectly ripe tomato growing on a vine is going to signal its condition via the 5G network to an AI who knows I love heirloom tomatoes at their peak; my AI will place an order for me based on standing instructions (after first confirming I am indeed expected home that evening, and that I already don’t have too many heirlooms on the counter), and an autonomous... »

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MEMS Ascendant at IMAPS Device Packaging 2017

Semiconductor device fabrication and packaging is rife with acronyms, and by my estimate, the Top 3 trafficked by speakers at the recent IMAPS Device Packaging Conference were the acronyms FOWLP, FOPLP, and MEMS. That would be fan-out wafer level packaging, fan-out panel level packaging, and microelectromechanical systems, respectively. It wasn’t that IMAPS was a MEMS packaging conference in the... »

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Executive Viewpoint: Next-Gen Drone Technologies Rely on Semiconductor Innovation

Robotics and drone technologies are one of the fastest growing end-use markets for integrated sensor technology today. According to a 2016 Yole Développement market report, the 2015 $351M US sensor market for drones and robots is expected to double by 2021, reaching US$ 709 million at a 12.4% CAGR. Key technologies include 3D cameras, solid state light detection and ranging (LIDAR), and ultra-pre... »

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Panel Level Packaging: One Size Fits All?

There is an active and robust supply chain currently supporting these wafer sizes in the semiconductor manufacturing industry: 3”; 4”; 6”; 200mm; 300mm; and 330mm. This wide range of substrates is successfully being used today for “sweet-spot’ manufacturing of LED, compound semiconductor, MEMS, trailing-edge CMOS, leading-edge CMOS, and fan-out wafer level packaging (FOWLP) applications,... »

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Outlook 2017: SoC Goes on a Dielet

It’s 2017, and system-on-a-chip (SoC) is headed for a dielet. At least that’s my 2017 outlook, based on takeaways from some of the recent conferences I’ve attended, including, to close out 2016, 3D ASIP last month in Burlingame, CA. SoC has been packing on weight in recent years, and it’s beginning to show, to SoC’s detriment. For example, the old ISO defect density rules from my early I... »

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MEPTEC Roadmap 2016: Best Time in History to be in the Packaging Business

With nary a farewell glance in the rearview mirror at the terrain successfully covered over the decades during which we followed the ITRS’ Guide Michelin; the new Heterogeneous Integration Roadmap gives us eyes on what comes next. It looks from here-and-now all the way to a horizon that extends, like a straight highway crossing America’s vast Great Plains, a long way out. Fifteen years out. A ... »

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MEMS & Sensors Executive Congress 2016 Sets Out to Conquer the Internet of Countless Things

A shift has occurred. As MEMS becomes mainstream, the focus of the annual MEMS & Sensors Executive Congress (MEC 2016) was less on MEMS development and more about the fun part: how we put these technologies to work for us. As Stefan Finkbeiner, Bosch Sensor Systems so eloquently put it, “Nobody wants to buy an accelerometer anymore, they want a step counter.” So how do we capture the value... »

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