EDA Tools

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium
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EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of holding it in Monterey, we moved EDPS to Milpitas to make it more easily accessible for Silicon Valley folks... »

Top Ten Reasons to Attend the 2017 European 3D Summit
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Top Ten Reasons to Attend the 2017 European 3D Summit

It’s that time of year again! For the 5th consecutive year, SEMI Europe is hosting the European 3D Summit (formerly known as the 3D TSV Summit for editions 1-3), and it’s shaping up to be a stellar event. If you are still wavering about attending, here are 3D InCites’ top ten reasons to attend: 10: The opportunity to visit beautiful Grenoble, and taste the local fare with your industry colle... »

Advanced Packaging Challenges and Opportunities for 2015
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Advanced Packaging Challenges and Opportunities for 2015

Our industry is seeing greater diversification in manufacturing processes than it has since its earliest days. In the front-end numerous new materials, architectures, and processes are under development to enable the continuing march toward smaller device sizes. In the back-end, and many places in between, advanced packaging processes and 3D integration are adapting processes from the front-end, v... »

Next-Gen MEMS Simulation Tool Makes Life Easier for ASIC Designers
MEMS+ 50 Briefing 2014-09-09

Next-Gen MEMS Simulation Tool Makes Life Easier for ASIC Designers

I don’t usually write about MEMS. But every once in a while, when MEMS (stands for micro-electromechanical systems) touches anything to do with 3D integration, usually at the system-level, I might veer slightly out of my comfort zone to interview a MEMS supplier about their latest developments. I find it’s a good way to learn about the synergies and to cross-pollinate information. Today wa... »

Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?
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Are Design Tools and Thermal Solutions the Missing Links to 2.5D and 3D IC Production?

On one side of the fence, we have semiconductor device manufacturers (fabs, foundries, and OSATS) claiming to be ready to ramp 2.5D and 3D IC devices to production, saying that remaining issues can be engineered out. On the other side, we have system integrators who, while they believe 2.5D and 3D ICs are the answer to their performance and power prayers, aren’t ready to dive in head first becau... »

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