Materials

Materials

Dow Corning: Thermally Conductive Gel TC-3040
TC-3040 TC3040 copy

Dow Corning: Thermally Conductive Gel TC-3040

TC-3040 is designed for advanced flip chip devices requiring improved heat dissipation.  The material features a combination of low modulus and high elongation – enabling it to accommodate warpage-induced stresses.  Key to the improved thermal performance : low contact resistance that silicones are known for, along with proprietary filler technology. Testimonial While advanced 2.5D or 3D... »

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry
solderon-bp-ts-6000_tin-silver-capped-µpillars

Dow Electronic Materials: SOLDERON™ BP TS 6000 Tin-Silver Chemistry

SOLDERON™ BP TS 6000 Tin-Silver is a lead-free chemistry for solder bump applications. From a single formulation, it is capable of plating speeds of 2-9+ µm/min, tunable composition and the industry’s most robust process window. This flexibility makes it ideal for applications from C4 bumping to micro-Cu pillar capping. Testimonial In the latest 2.5D and 3D packaging schemes utilizing copper ... »

Indium Corporation: Wafer Flux WS-3543
wafer-flux Wafer Flux WS-3543

Indium Corporation: Wafer Flux WS-3543

Indium Corporation’s wafer bumping flux WS-3543 is a low-viscosity semiconductor-grade flux, specifically optimized for uniform solder bump formation across wafers up to 300mm (12 inches) in diameter. WS-3543 washes off completely, even after repeated application, reflow, and cleaning cycles, as may be seen in bump rework and after probe testing. Testimonial Indium Corporation’s wafer bumping ... »

Dynaloy: Dynastrip DL9150
676015 Dynastrip Dl9150

Dynaloy: Dynastrip DL9150

The newly released Dynastrip™ DL9150 is a non-TMAH containing multi-purpose photoresist and post-etch residue remover. With outstanding cleaning and metal compatibility, this product raises the bar for achieving environmental, health, and safety compliance while also performing as well as comparable products that contain TMAH. Testimonial: Dynaloy’s new solvent, Dynastrip DL9150, has demonstra... »