In a deal that is expected to generate economical new process options for the 3D integration market, Alchimer S.A., a provider of nanometric deposition technology for semiconductor interconnects and through-silicon vias (TSVs), and KPM Tech Co. Ltd., a manufacturer of plating materials and systems, announced a multi-level collaboration that gives KPM Tech exclusive rights to produce chemicals in Korea for Alchimer’s technology. The agreement also includes the manufacture of various configurations of wet processing tools to support the Alchimer TSV platform.
Alchimer’s breakthrough technology, Electrografting (eG™), is an electrochemical- based process that enables the growth of extremely high quality polymer and metal thin films on both conducting and semiconducting surfaces. Alchimer’s deposition technology reduces overall cost of ownership for high aspect ratio TSV metallization by up to two-thirds compared to conventional dry processes, while shortening time to market.
“KPM Tech and Alchimer are an excellent match because we both understand the need to move quickly with breakthrough technologies, and bring them to market in a customer-friendly way,” said Alchimer CEO Steve Lerner. “This agreement enables several key next steps in Alchimer’s transition into volume production environments, and also gives Alchimer a strategic presence in South Korea, which accounts for half the world’s memory production and will offer convenient access to our Asian customers.”
“Our discussions with Alchimer have made it clear that their technology provides real and immediate advantages for chipmakers adopting 3D interconnects,” said Chae Chang-Geun, CEO of KPM Tech. “This is a logical, strategic partnership that will enable us to apply our existing manufacturing infrastructure for chemicals and coating systems, while substantially expanding our available market.”