IMAPS Executive Summit – Advanced Packaging 2025: Market Momentum and Investment Outlook
Join an exclusive gathering of industry visionaries, market strategists, and technology leaders, as the IMAPS Silicon Valley Chapter convenes Advanced Packaging 2025 – a premier executive forum focused on the forces shaping the future of semiconductor innovation. This high-impact event brings together the unique ecosystem of Silicon Valley: from disruptive startups and forward-thinking investors to seasoned analysts and corporate decision-makers. It will explore the market momentum, investment outlook, and technology trends driving the next wave of advanced packaging.
Designed for senior executives and strategic stakeholders, the IMAPS Executive Summit program offers:
- Actionable insights into emerging market dynamics and capital flows
- Expert perspectives on packaging’s evolving role in enabling next-gen solutions
- Curated networking with peers shaping the semiconductor landscape
Event Details
- Hosted at Rapidus in Santa Clara, California – 3945 Freedom Circle, Suite 920, Santa Clara, CA 95054
- September 24-25
- September 24 program will focus on vision, investment, and strategy
- September 25 program will highlight innovation, intelligence, and breakthroughs for the innovation stack: chiplets, photonics, and agentic AI
Register for the event: https://imaps.org/page/ExecutiveSummitSiliconValley
