ACM Research Announces Order for SAPS Evaluation Tool from Major Global Semiconductor ManufacturerOct 26, 2021 · By ACM Research · Press Releases FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing...
ACM Research Secures Order for ECP Demo Tool from Major IC ManufacturerOct 26, 2021 · By ACM Research · Press Releases FREMONT, Calif., Oct. 18, 2021 (GLOBE NEWSWIRE) — ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing...
ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing Aug 30, 2021 · By ACM Research · Press Releases Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021 Fremont, Calif. – August 25,...
ACM Research Enters Bevel Etch Market to Support Emerging Process Steps in 3D NAND, DRAM and Advanced Logic ManufacturingAug 25, 2021 · By ACM Research · Press Releases Wet process offers edge etch and clean to improve wafer yield with high throughput and low chemical consumption; First tool...
Trends in Semiconductor Manufacturing: Wafer-Level PackagingMay 18, 2021 · By Jim Straus · Blogs One of the hottest trends in semiconductor manufacturing today is wafer-level packaging (WLP). According to Allied Market Research, the global...
What You Need to Know About Sustainability in SemiconductorsMay 12, 2021 · By Jim Straus · From Different Dimensions While the global spotlight is shining on the importance of sustainability in semiconductors, the concept itself is not new. As...
ACM Research Significantly Improves Copper Plating Rate and Uniformity for Advanced Packaging Applications with New High-Speed Plating TechnologyMar 10, 2021 · By ACM Research · Press Releases New ECP ap capability controls the wafer-level electric field to deliver better uniformity within wafer and within die while achieving...