A long-time evangelist of 3D integration technologies, Herb Reiter puts more than 20 years of experiences in technical and business roles at semiconductor and EDA companies to work, providing a holistic perspective and insight on how to bring 3D integration to the masses.
SEMICON West Navigates Semiconductor Industry Changes
As Benjimen Franklin said, shortly after the US Constitution was written, “In this world, nothing can be said to be certain, except death and taxes.” I’ll add one comment to that: Change. Change is constant. Over the past year, there has been a significant amount of change in the semiconductor...
Advanced Packaging: A Community Coming Together
In the past 16 years, 3D InCites has watched the 3D packaging industry grow. The philosophy of 3D InCites was to create an advanced packaging community. At SEMICON West in Phoenix, the community was out in force, from ribbon-cutting ceremonies for new facilities, to new packaging equipment companies showing for...
The 3DICAMA and Other Efforts to Develop the 3D IC Ecosystem
This Fall has been a busy time for semiconductor events. Starting with SEMICON Taiwan at the start of the month, IMAPS in Late September into early October, followed closely by SEMICON West last week. Fortunately, there is a month off to catch your breath before heading to Semicon Europa. There...
Can We Make Data Centers Less Power Hungry?
When the headline reads “Power Usage in Wyoming data center could eclipse consumption if the state’s human residents by 5x, the tenant of colossal investment remains a mystery.“ It grabs your attention. The article goes on to discuss that the data center is expected to start at 1.8 gigawatts and...
The Data Center Power Conundrum
The “Great Big Beautiful Bill” just passed by the U.S. Congress is highlighting the critical nature of the electricity supply in the United States. Unfortunately, renewables are getting the short end of the stick, but nuclear power is getting more support as a viable low-carbon source. With the rapid deployment...
HPC Drivers and Regionalization Means Steady Growth for Semi Capex and Capacity
Takeaways from the SEMI Capex and Capacity Seminar With Nvidia announcing its earnings in May, it brings closure to the CY Q1 financial calendar. Because of geopolitical and economic uncertainty, the earnings calls had slightly different outlooks over the timing of the quarterly financial announcements, from Micron in April to...
TSMC 2025 Technology Symposium: A Commitment to Customers
Nanosheets, Superpower rails, 3D Fabric, SoW, along with N2, N3, 16A, and 14A. Enough acronyms and numbers to make your head spin. All of these terms and more were discussed at the TSMC 2025 North America Technology Symposium in Santa Clara, held in late April. TSMC holds this event annually...
Onshoring Advanced Packaging Update
Rarely a week goes by without Jensen Huang, the CEO of Nvidia, being in the news. In late March, during Nvidia’s GTC developers conference, Huang was in the news daily as he updated the world on how Nvidia was addressing hardware and software needs for AI, as well as starting...
Artificial Intelligence is Driving Panel Level Packaging
An Intel engineer holds a test glass core substrate panel at Intel’s Assembly and Test Technology Development factories in Chandler, Arizona, in July 2023. Intel’s advanced packaging technologies come to life at the company’s Assembly and Test Technology Development factories. (Credit: Intel Corporation) TSMC has announced a roadmap to 9...
Meeting Sustainability Goals Hits Political and Technical Headwinds
Sustainability goals and efforts are starting to hit some headwinds in the world. In the United States the Trump administration has yet again pulled out of the Paris agreement, and has a campaign promise of “Drill baby, drill!”. However, the United States is not alone in the challenges of keeping...
