Smoltek has yet another patent granted. This time in Taiwan. The patent is related to the Assembly platform patent family in the direction of interconnects. This also makes our patent portfolio to now comprise 70 granted patents.

Smoltek’s 70th patent has been granted in Taiwan and relates to the Assembly platform family, and this particular application is in the field of interconnects and heterogeneous integration.

Our Assembly platform patent family is a pathway to tap into the ever-increasing demand for miniaturization of electronic components and interconnect them in the form of an assembly to minimize footprint at the packaging level.

“Through this patent grant, we once again demonstrate our technical and innovative ability to take advantage of the great potential of our technology platform, ”says Karl Lundahl, VP Product management & Industrialization at Smoltek.

In the context of Assembly platform and interconnects, the present applications concepts take advantage of the wettability properties of nanostructures to form small sized composite interconnect bumps together with traditional solder/metal materials. Such composite interconnects provide a means to improve the electrical reliability of the solder/metal bumps since carbon nanostructures are inherently capable of carrying high current at a much smaller footprint.

Smoltek’s patent portfolio now globally comprises 70 granted patents. Read more about our IP and patents.


Smoltek is a global technology provider for the new wave of advanced packaging and heterogenous…

View Smoltek's posts

Become a Member

Media Kit