Solid State Equipment LLC (SSEC), provider of single-wafer wet processing systems for advanced packaging (including 2.5D and 3D-ICs), MEMS, and compound semiconductor markets, announces two major wins for its WaferStorm platform at a leading foundry in Asia and a major US integrated device manufacturer (IDM). In both cases, the systems were selected for their thick-film removal capabilities which provide residue-free removal of difficult thick-film photoresists and dry films at a low cost of ownership.
“As the industry moves to finer-pitch, smaller-feature micro-bumping processes for wafer-level packaging, removal of thick-film resists has become more of a challenge,” says Erwan Le Roy, Marketing Vice President of SSEC. “We developed SSEC’s process for thick-film removal with these next-generation challenges in mind. These significant tool wins substantiate SSEC’s capability to provide advanced process solutions.”
The WaferStorm Thick-Film Remover combines heated chemistries and proprietary soak-and-spray at high pressure for rapid and complete removal of stubborn thick-film residue. The soak step uses heated solvents throughout the buffer cycle time. After softening the thick resist in the soak, the wafers are transferred to the single-wafer spray station where they are exposed to high-pressure fan sprays with heated solvents for rapid removal of thick-film residue. This combination ensures thorough removal and increased throughput.