A*STAR and EDB launch 3D TSV consortium in Singapore

The Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), launched a 3D through silicon via (TSV)consortium
to boost next-generation 300mm wafer manufacturing capability and meet technology and product needs of the Singapore semiconductor industry.

This national initiative is supported by the Singapore Economic Development Board (EDB) and A*STAR. IME is teaming up with A*STAR’s Institute of High Performance Computing (IHPC) and Nanyang Technological University (NTU) for the two-phase consortium. Phase 1 will be lead by IME and includes participation from Chartered Semiconductor, STATS ChipPAC, and United Test and Assembly Center Ltd. (UTAC). The consortium will also leverage strategic materials and equipment suppliers for support in its endeavors.