Advertise here
IMAPS 3D InCites Content Platform
  • 3D In-Depth
    • What is 3D Integration?
    • Design
    • Devices
    • Manufacturing
    • Materials
    • Processes and Technology
    • Test and Inspection
  • Community
    • IMAPS Corporate Membership
    • News
    • White Papers
  • Blogs
    • Francoise in 3D
    • Packaging IFTLE
    • 3D In Context
    • From Different Dimensions
    • Interconnectology 101
  • Events
    • IMAPS Calendar
    • Event Coverage
  • 3D InCites Podcasts
  • About Us
    • Acceptable Use Policy
    • Support the 3D InCites DEI Scholarship Fund

onshoring

Latest Posts

IFTLE 644: IBM’s Scott Sikorski details their Onshore Advanced Packaging for AI, HPC and Defense Applications                                                                                       

Oct 27, 2025 · By Phil Garrou · Blogs
The recent IMAPS Onshoring workshop included Scott Sikorski, IBM Global Business Development Leader, reviewing details of their onshore advanced packaging...
Advertise here
Advertise here
Advertise here

Whitepapers

the unseen marvels of semiconductors

Semiconductor Packaging Materials: The Unseen Marvels of Semiconductors

Oct 02, 2024

Semiconductors are the micro-sized “brains” that power modern electronics, and...

Recommended Reads

Europe’s Advanced Packaging: Progress, Players, And The Road Ahead

Dec 23, 2025

Fifty years of Semicon Europa set a fitting backdrop for...

From Pilot Lines To Fabs: How Europe Builds Semiconductor Resilience

Dec 10, 2025

Europe’s chip future is being built in real time, and...

Most Active Authors

Francoise von Trapp Francoise von Trapp 3D Incites Editor 3D Incites Editor Phil Garrou Phil Garrou Dean Freeman Dean Freeman Herb Reiter Herb Reiter Paul Werbaneth Paul Werbaneth Julia Freer Julia Freer Trine Pierik Trine Pierik Jillian McNichol Jillian McNichol Jean-Christophe ELOY Jean-Christophe ELOY Andrew Walker Andrew Walker Bill Martin Bill Martin
Advertise here

Become a Member

Media Kit

Sitemap

  • 3D In-Depth
    • What is 3D Integration?
    • Design
    • Devices
    • Manufacturing
    • Materials
    • Processes and Technology
    • Test and Inspection
  • Community
    • IMAPS Corporate Membership
    • Press Releases
    • White Papers
  • Blogs
    • Francoise in 3D
    • Packaging IFTLE
    • 3D In Context
    • From Different Dimensions
    • Interconnectology 101
  • Events
    • Calendar
    • 3D Event Coverage
  • About Us
    • IMAPS 3D InCites Acceptable Use Policy

Copyright © 2026

We are using cookies to give you the best experience on our website.

You can find out more about which cookies we are using or switch them off in .

by  GDPR Cookie Compliance
Privacy Overview

This website uses cookies so that we can provide you with the best user experience possible. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which sections of the website you find most interesting and useful.

Please visit our Privacy Policy page.

Necessary

Strictly Necessary Cookie should be enabled at all times so that we can save your preferences for cookie settings.

Analytics

This website uses Google Analytics to collect anonymous information such as the number of visitors to the site, and the most popular pages.

Keeping this cookie enabled helps us to improve our website.

Marketing

This website uses the following additional cookies:

Klaviyo Cookies

x  Powerful Protection for WordPress, from Shield Security
This Site Is Protected By
Shield Security →