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Latest Posts

IFTLE 644: IBM’s Scott Sikorski details their Onshore Advanced Packaging for AI, HPC and Defense Applications                                                                                       

Oct 27, 2025 · By Phil Garrou · Blogs
The recent IMAPS Onshoring workshop included Scott Sikorski, IBM Global Business Development Leader, reviewing details of their onshore advanced packaging...
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Advanced iBGA Image Sensor Encapsulation

Apr 09, 2026

PFAS-free solution meeting stringent quality standards for automotive vision systems...

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3D InCites ~ IMAPS Vision for the 3D InCites Platform Going Forward

Mar 23, 2026

Eelco Bergman (IMAPS VP of Marketing) and Scott Hayes (IMAPS...

3D InCites Now Powered by IMAPS ~ A Conversation about the Transition

Mar 23, 2026

In early 2026, IMAPS took over the “stewardship” of the...

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Francoise von Trapp Francoise von Trapp 3D Incites Editor 3D Incites Editor Phil Garrou Phil Garrou Dean Freeman Dean Freeman Herb Reiter Herb Reiter Paul Werbaneth Paul Werbaneth Julia Freer Julia Freer Trine Pierik Trine Pierik Jillian McNichol Jillian McNichol Jean-Christophe ELOY Jean-Christophe ELOY Andrew Walker Andrew Walker Bill Martin Bill Martin
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