IC design

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

EDPS 2017: NOT the usual Electronic DESIGN Process Symposium

When planning the 24th EDPS, the organizing committee, chaired by Shishpal Rawat, former Intel executive, took a number of bold steps EDPS was traditionally held in the spring. We moved EDPS to the fall because that’s a time when more new IC projects are being planned. After many years of holding it in Monterey, we moved EDPS to Milpitas to make it more easily accessible for Silicon Valley folks... »

3D InCites Guide to SEMICON WEST 2016

3D InCites Guide to SEMICON WEST 2016

In past years, we have provided 3D InCites readers with a guide for navigating through the myriad programs that specifically address 3D integration and packaging at SEMICON West. This year, as SEMI has discovered, everything has changed; and thus they themed SEMICON West 2016, “Definitely NOT business a usual.” As an industry, we have moved far beyond the point of industry segments working... »

DAC 2016: There is More to Life than IC Design

DAC 2016: There is More to Life than IC Design

In the past, the Design Automation Conference was known to me and many of my colleagues as the annual event that focused on IC design tools, flows, and methodologies. EDA tools vendors and users got together in the previous millennium to discuss what to do next in a rapidly growing market segment. Then things changed… At the beginning of this millennium, the wafer foundries took charge of silic... »

Breaking Down Walls between Board, Package, and IC Design Steps

Breaking Down Walls between Board, Package, and IC Design Steps

Many years ago, when I started in the semiconductor business, the circuit designers only had to worry about functionality and, after completing their job, “threw the design over the wall” to the layout team or contractor. As recently as 10 years ago, IC designers only had to worry about silicon performance and after verifying functionality and timing, they “threw the design over the wall” ... »