06/03/2014 -7:00 pm - 8:00 pm

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Webinar on monolithic and 3D IC stress and warpage during package stacking and assembly modeling using automated FEA technique. Use of Cielution’s assembly process simulation automation Software As A Service CielMech will be demonstrated using a practical use case.

Register athttps://attendee.gotowebinar.com/rt/4706849108237603329

Who Should Attend?   The webinar is open to professionals in the semiconductor and IC Packaging industry.