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Webinar on monolithic and 3D IC stress and warpage during package stacking and assembly modeling using automated FEA technique. Use of Cielution’s assembly process simulation automation Software As A Service CielMech will be demonstrated using a practical use case.
Register at: https://attendee.gotowebinar.com/rt/4706849108237603329
Who Should Attend? The webinar is open to professionals in the semiconductor and IC Packaging industry.
