12/03/2014 - 12/05/2014 -All Day

Location: Tokyo Big SIght

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SEMICON Japan 2014 will be held on December 3 to 5 at a new venue, Tokyo Big Sight.

First held in 1977, SEMICON Japan has grown to become the largest international exhibition of semiconductor equipment and materials. Bringing companies and their technologies together with customers and partners, as well as providing a setting for technical seminars and meetings, SEMICON Japan actively supports the growth of the global semiconductor industry.

2.5D/3D ICs: Recent Advances in the Industry, Friday, December 5, 10:10-11:50am

Although the expectation of mass production of 2.5D/3D is increasing, its schedule varies among the different manufacturers. Technology executives of leading enterprises talk about 2.5D/3D in various aspects such as process, cost, ramping status, equipment situations, and show the scenario to leap for success.

Chairperson: Uegaki, ASE Grou

Speakers: 

Title TBD
CP Hung
Corporate R&D, Vice President
ASE

2.5D/3D ICs: Recent Advances in the Industry
Suresh Ramalingam
Packaging Design and Technology, Senior Director
Xilinx

Wafer-level system integration (Pseudo-SoC) technology and its wearable intelligent smart senor module application
Hiroshi Yamada
Senior Research Scientist
Electron Devices Laboratory,Corporate Reseach & Development Center
Toshiba Corp.

This presentation provides an overview of the pseudo-SoC (System on Chip) technology which overcomes the limitation of the heterogeneous devices integration with wafer-level system integration in the electronics products, and then offers the prototype model of the wearable intelligent smart senor module which has high-density one-chip AFE (Analog Front End) circuits realized by the pseudo-SoC technology.