SEMICON China is the world’s leading semiconductor industry annual event, serving the thriving Chinese market. To usher in the twenty-seven years this event has bee held in China, the global industry leaders will come together and seek common development plans. SEMICON 2016 is held concurrently with China Semiconductor Technology International Conference-CSTIC China 2016 and FPD China 2016. This year’s event is organized around six themes, including LED Manufacturing Pavilion, IC Material Pavilion, TSV Pavilion, MEMS Pavilion, Secondary Equipment Applications Service and Fab Productivity Solutions Pavilion and the IC Application Pavilion.
The TSV Pavilion will supply a platform to display key equipment in current TSV technology, TVS packaging materials and relevant technical service from the perspective of electronic system application and market demand.
Brief Analysis on TSV Market
To comply with the eternal theme that electronic products are developing to meet the market demand of “lighter, thinner, shorter and smaller”, TSV will gradually become a key technology for future IC industry. Before 2013, the output value of TSV will account for 5-6% of the semiconductor device market with nearly USD 14–17 billion; memory industry is an important field in TSV technology application and it is estimated that TSV will take up about USD 4 – 5 billion of total memory output. (Stromberg Data) The development of TSV technology will bring a huge opportunity for three sectors: semiconductor equipment, materials and service. In terms of equipment, the scale of market value is expected to reach USD 12 billion with materials and services end respectively USD 625 million and USD 2.2 billion. (Stromberg Data)
For more information and to register, visit the SEMICON China website.