It has become the Era of Mobile Internet to the Semiconductor industry, since smart phone replaced PC to be the driven force of the market. Communication has done great and important role in mobile era and is absolutely necessary in any relationship. Handset, wearable device, OBU and IOT change our lifestyle.
SEMICON China 2015 will organize the “Advanced Packaging Forum”, where industry elites sit together to discuss the technology and solution for the Era of Mobile Internet. From the market trend to product application with the various assembly and test technology, innovative equipments and materials, we will map a new blueprint of the industry. Details are available here.
SEMICON China also features a TSV Pavilion, a new exhibition section that supplies a platform to display key equipment in current TSV technology, TSV packaging materials. and relevant technical serviced from the perspective of electronic system application and market demand.