The 27th annual SEMI Advanced Semiconductor Manufacturing Conference, which takes place 16 – 19 May 2016, Saratoga Springs, NY.provides semiconductor professionals with an unparalleled opportunity to network and learn the latest information in the practical application of advanced semiconductor manufacturing strategies and methodologies. ASMC 2016 features technical sessions highlighting strategic manufacturing issues, as well as insightful keynotes, a provocative panel discussion, and an informative tutorial.
Of particular interest to 3D InCites readers:
3D/TSV Session
Chairs: James Lu, RPI; Thuy Tran-Quinn, IBM; Russell Dover, Lam Research
This session will cover key innovations in the field of 3D/2.5D/Through-silicon via technology (TSV) technology including TSV processing, underfill, defects and others.
Panel Session: Moore’s Law Wall vs. Moore’s Wallet, and Where Do We Grow From Here?
Moderator: Paul Werbaneth, Global Product Marketing Director, Intevac (ASMC steering committee)
Invited Panelists:
- Patrick Martin, Head of Field Technology, Transistor and Interconnect, Applied Materials
- Andreas Knorr, Director of Technology Research, GLOBALFOUNDRIES
- David Bloss, Director, Fab Equipment, GSM; Vice President, Technology Manufacturing Group, Intel Corporation
- Michael Campbell, Vice President of Engineering, Qualcomm
- Samsung (invited)
