09/28/2021 - 09/29/2021 -12:00 am

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Aiming at facilitating mutual engagement, the SEMI Packaging Technology Seminar will foster collaboration among semiconductor packaging, assembly, test manufacturing, and design experts, to collectively strengthen the semiconductor back-end industry in Europe.

This is a great opportunity to meet with members of the SEMI integrated Packaging, Assembly and Test Technology Community (ESiPAT-TC), pioneered by the European chapter established in 2016.

Key topics presented  

  • European OSAT industry capabilities
  • New technology developments in challenging times
  • European market and supply chain
  • Device and packaging manufacturers trends
  • Advocacy for the packaging, assembly, and test industry in Europe


More information can be found here.