The 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and Packaging Society (IMAPS) and held in San Diego, California. IMAPS Symposium 2025 offers one of the most robust programs for microelectronics and advanced packaging technical content. Each year, IMAPS welcomes many repeat attendees, as well as hundreds of first-time visitors – early career packaging professionals, those new to the industry, and students.
IMAPS Symposium 2025 kicks off with professional development courses, followed by three days of technical sessions with emphasis on advanced package structures (heterogeneous integration, HPC, AI); advanced interconnect, bumping & wirebond technologies; RF, MEMS/sensors, high rel, WLCSP, small body FO; enabling materials & advanced equipment; and CPI, modeling, design, and metrology.
Learn more: https://imaps.org/page/IMAPS2025
