The IEEE International Interconnect Technology Conference 2014 (IITC 2014) will be held May 21 – 23, 2014 in conjunction with the 31st Advanced Metallization Conference at the DoubleTree Hotel in San Jose, California. It will be preceded by a day-long workshop on “Manufacturing of Interconnect Technologies: Where are we now and where do we go from here?” on Tuesday, May 20. The conference attracts professionals from industry, academia, and national laboratories in semiconductor processing, interconnect design, and equipment development.
The IITC is sponsored by the IEEE Electron Devices Society as a premier conference for interconnect technology. The joint conference will mark the 31st AMC in an annual series of meetings devoted to leading-edge research in the field of advanced metallization and 3D integration for ULSI IC applications.