GSA 3D IC Working Group Meeting | July 17, 2013

Overview

The working group explores 3D IC development cost down activity, looking at TSV production improvement. SSEC will present enhance tool efficiencies. Alchimer addresses one of the most significant cost adders, Copper BEOL with its processes.

Registration

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Date/Time:
July 17, 2013
2pm – 5pm (PST)Host / Location:
Rambus
1050 Enterprise Way, Suite 700
Sunnyvale, CA 94089
USA

Webcast Information:
If unable to attend in person, please join our Webcast / Conference Call:Dial In Numbers:
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Participant Passcode: 842 910 4881Webcast: GSA Working Groups Meeting
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Meeting Agenda

Time	Agenda Item
2:00 p.m.	Opening Remarks
2:15 p.m.	Low CoO TSV Reveal using Wet Processing Laura Mauer, CTO, SSECIn an effort to drive TSV adoption in production, cost reduction is critical. An “all wet” single tool approach will be discussed to replace 4 equipment for the TSV reveal process: CMP, plasma dry etch, Silicon thickness measurement and cleaning.
2:45 p.m.	Alchimer Solution for TSV Cost Reduction Naohiro Shoda, Business & Technology Development Director, Alchimer, This presentation addresses one of the most significant cost adders, Copper BEOL with its processes.
3:15 p.m.	Project discussions: Business Models; Almanac; ESD Checklist; Assembly & Test Checklist
4:15 p.m.	Logistics; Wrap-up