10/22/2014 -2:00 pm - 5:00 pm

Location: STATS ChipPAC

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Numerous companies are actively pursuing 3D-IC product development. The GSA 3D IC Working Group runs a series of presentations to address readiness of the packaging design environment. We will look at the impact of various assembly flows, chip stack architecture, package options and types, test flow, etc.

  • 2:00 p.m. Opening Remarks Harrison Beasley, GSA
  • 2:10 p.m. Farhang Yazdani, BroadPak
    2.5D/3D devices are currently under development across the semiconductor industry and the enabling technologies are evolving rapidly to keep pace with the new requirements. In this presentation we will discuss the latest co-design interaction challenges, flows, methodologies and the requirements for a successful integration.
  • 2:45 p.m. Sitaram Arkalgud, Invensas
  • 3:15 p.m. Paul Silvestri, Amkor
    A status of TSV packaging and technology will be reviewed covering both 3D and 2.5D constructions. Current TSV and packaging activities leading up to production and the market requirements supporting them will be included. And finally barriers to wide adoption of TSV technology will be reviewed.
  • 3:45 p.m. ESD Best Practices
  • 4:15 p.m. Logistics and Wrap-Up

Meeting Registration 

Webcast Information:
If unable to attend in person, please join our Webcast / Conference Call:

Dial In Numbers:
Phone: 1-719-325-2630
Participant Passcode: 306 711#

Webcast: GSA Working Groups Meeting 
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